Semiconductor wafer measurement method and system
US10762621B2 · kind B2 · utility
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15References
20Claims
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Key dates
| Filing date | May 1, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | May 1, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method includes capturing a raw image from a semiconductor wafer, assigning a measurement box in the raw image, arranging a pair of indicators in the measurement box according to graphic data system (GDS) information of the semiconductor wafer, measuring a distance between the indicators, and performing a manufacturing activity based on the measured distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.