Semiconductor structure and semiconductor package device using the same
US10763133B2 · kind B2 · utility
0Cited by
7References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Nov 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure for manufacturing a semiconductor package device is provided. The semiconductor structure includes a carrier and a dielectric layer. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer. The dielectric layer is formed on the first surface of the carrier. The carrier supports the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.