Recipe optimization based zonal analysis

US10763146B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Roie Volkovich · Migdal HaEmek, IL
• Michael Adel · Zichron Ya'akov, IL
• Liran Yerushalmi · Raanana, IL
• Eitan Herzel · Yafia, IL
• Mengmeng Ye · Shanghai, CN
• Eran Amit · Haifa, IL

Key dates

• Filing date: Dec 11, 2017
• Grant date: Sep 1, 2020
• Expiry date: Sep 24, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.