System for coupling a voltage to spatially segmented portions of the wafer with variable voltage
US10763150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Mar 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide independent pulses of direct-current (“DC”) voltage through a switching system to electrodes disposed in the ESC substrate support. In some embodiments, the switching system can independently alter the frequency and duty cycle of the pulsed DC voltage that is coupled to each electrode. In some embodiments, during processing of the substrate, the process rate, such as etch rate or deposition rate, can be controlled independently in regions of the substrate because the process rate is a function of the frequency and duty cycle of the pulsed DC voltage. The processing uniformity of the process performed on the substrate is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.