Patent · US Active

Substrate supporting apparatus

US10770335B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Fufa Chen · Cupertino, US
Zhiyou Fang · Shanghai, CN
Jun Wu · Shanghai, CN
Hui Wang · Shanghai, CN
Fuping Chen · Shanghai, CN
Wenjun Wang · Nagaokakyo, JP

Key dates

Filing date	Jul 6, 2016
Grant date	Sep 8, 2020
Priority date	—
Expiry date	Jul 6, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68792
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided. The substrate supporting apparatus (300) has a hollow shaft (319) and a rotary spindle (303). The rotary spindle (303) is set in the hollow shaft (319) and a spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the rotary spindle (303) defines a blocking wall (322) and a recess (324) to prevent particles in the spacing from entering a gas groove (325) which is formed on the hollow shaft (319) and supplies gas to a front side of the substrate (107), avoiding the particles contaminating the front side of the substrate (107), which improves the quality of semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.