Semiconductor package having a filled conductive cavity

US10770399B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Chee Yang Ng · Kluang, MY
• Hock Siang Chua · Kluang, MY
• Stefan Macheiner · Kissing, DE
• Josef Maerz · Oberhaching, DE
• Nurfarena Othman · Melaka City, MY
• Joseph Victor Soosai Prakasam · Melaka City, MY
• Hong Hock Tay · Muar, MY

Key dates

• Filing date: Feb 13, 2019
• Grant date: Sep 8, 2020
• Expiry date: Feb 13, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1431
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.