Inventor · Kluang, MY

Chee Yang Ng

22Patents
2h-index
41Co-inventors
53Inventor score

Filing activity: Jul 26, 2013 → Dec 23, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10549985B2 Semiconductor package with a through port for sensor applications Performing Operations; Transporting 3 Active
US9628918B2 Semiconductor device and a method for forming a semiconductor device Electricity 2 Active
US11676879B2 Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier Electricity 1 Active
US12136583B2 Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement Electricity 0 Active
US11393743B2 Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation Electricity 0 Active
US12412797B2 Hybrid embedded package Electricity 0 Active
US10109592B2 Semiconductor chip with electrically conducting layer Electricity 0 Active
US10501312B2 Over-under sensor packaging with sensor spaced apart from control chip Electricity 0 Active
US12232302B2 Dipped coated electronic module assembly with enhanced thermal distribution Electricity 0 Active
US9868632B2 Molded cavity package with embedded conductive layer and enhanced sealing Electricity 0 Active
US10163812B2 Device having substrate with conductive pillars Electricity 0 Active
US11521907B2 Hybrid embedded package Electricity 0 Active
US10304780B2 Device having substrate with conductive pillars Electricity 0 Active
US12150236B2 Voltage regulator module with inductor-cooled power stage Electricity 0 Active
US11039231B2 Package with acoustic sensing device(s) and millimeter wave sensing elements Physics 0 Active
US10770399B2 Semiconductor package having a filled conductive cavity Electricity 0 Active
US12094807B2 Stacked transistor chip package with source coupling Electricity 0 Active
US10224260B2 Semiconductor package with air gap Electricity 0 Active
US11289436B2 Semiconductor package having a laser-activatable mold compound Electricity 0 Active
US11984392B2 Semiconductor package having a chip carrier with a pad offset feature Electricity 0 Active
US11174152B2 Over-under sensor packaging with sensor spaced apart from control chip Electricity 0 Active
US9117807B2 Integrated passives package, semiconductor module and method of manufacturing Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.