Guard ring for photonic integrated circuit die
US10770412B2 · kind B2 · utility
3Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Aug 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the disclosure provide a photonic integrated circuit (PIC) die including: a semiconductor substrate; active circuitry on the semiconductor substrate; an inter-level dielectric (ILD) over the semiconductor substrate and the active circuitry; a photonic element extending from the active circuitry on the semiconductor substrate; and a guard ring on the semiconductor substrate and within the ILD, the guard ring surrounding the active circuitry, the guard ring including: a conductive body, and a conductive bridge element extending over the photonic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.