Using sacrificial solids in semiconductor processing
US10784101B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
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Key dates
| Filing date | Dec 19, 2017 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an example, a method may include closing an opening in a structure with a sacrificial material at a first processing tool, moving the structure from the first processing tool to a second processing tool while the opening is closed, and removing the sacrificial material at the second processing tool. The structure may be used in semiconductor devices, such as memory devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.