Patent · US Active

Method of forming a structure on a substrate

US10784102B2 · kind B2 · utility

3Cited by
1,652References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 20, 2019
Grant dateSep 22, 2020
Priority date—
Expiry dateFeb 20, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02315
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method of providing a structure by depositing a layer on a substrate in a reactor. The method comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.