Semiconductor package
US10784206B2 · kind B2 · utility
2Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Sep 22, 2020 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.