Method for cleaning chamber of substrate processing apparatus
US10786837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jul 23, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B5/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
According to the present invention, a substrate processing apparatus has a chamber (1), a stage (4) for holding a substrate (W) to be processed in the chamber (1), and a nozzle part (13) from which a gas cluster is blasted onto the substrate (W) to be processed, and has a function for processing the substrate (W) to be processed by the gas cluster. Cleaning of the inside of the chamber (1) is performed by: placing a prescribed reflecting member (dW, 60) in the chamber (1), blasting a gas cluster (C) onto the reflecting member (dW, 60), and applying the gas-cluster flow reflected by the reflecting member (dW, 60) onto a wall section of the chamber (1) to remove particles (P) adhered to the wall section of the chamber (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.