Prediction based chucking and lithography control optimization
US10788759B2 · kind B2 · utility
4Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jul 30, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70783
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.