Dynamic cooling control for thermal stabilization for lithography system
US10788762B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2019 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70891
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments described herein provide a system, a software application, and methods of a lithography process that provide at least one of the ability to decrease the stabilization time and write an exposure pattern into a photoresist on a substrate compensating for the change in the total pitch over a stabilization time. One embodiment of the system includes a slab, a stage disposed over the slab, a pair of supports disposed on the slab, a processing apparatus, and a chiller system. The pair of supports support a pair of tracks and the stage is configured to move along the pair of tracks. The processing apparatus has an apparatus support coupled to the slab and a processing unit supported by the apparatus support. The processing unit has a plurality of image projection systems. The chiller system has at least one fluid channel disposed in each track of the pair of tracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.