Patent · US Active

Fin structures

US10790198B2 · kind B2 · utility

3Cited by
6References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 8, 2018
Grant dateSep 29, 2020
Priority date
Expiry dateAug 8, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76224
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to fin structures and methods of manufacture. The structure includes: a plurality of fin structures formed of substrate material; a semiconductor material located between selected fin structures of the plurality of fin structures; and isolation regions within spaces between the plurality of fin structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.