Fin structures
US10790198B2 · kind B2 · utility
3Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Aug 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to fin structures and methods of manufacture. The structure includes: a plurality of fin structures formed of substrate material; a semiconductor material located between selected fin structures of the plurality of fin structures; and isolation regions within spaces between the plurality of fin structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.