Patent · US Active

Methods and systems for material property profiling of thin films

US10790203B2 · kind B2 · utility

0Cited by

20References

18Claims

0Family size

Assignee

Active Layer Parametrics, Inc. · US

Inventors

Bulent M. Basol · Manhattan Beach, US
Abhijeet Joshi · Los Angeles, US
Jalal Ashjaee · Cupertino, US

Key dates

Filing date	Apr 25, 2017
Grant date	Sep 29, 2020
Priority date	—
Expiry date	Apr 25, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/3341
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods, tools and systems for full characterization of thin and ultra-thin layers employed in advanced semiconductor device structures are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.