System-in-package with double-sided molding
US10797024B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2020 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Mar 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.