Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields
US10802404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Nov 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An exposure method includes projecting a reticle pattern into a first exposure field of a photoresist layer, wherein the reticle pattern includes first and second line patterns on opposite edges of the reticle pattern and wherein at least the first line pattern includes an end section through which light flux decreases outwards. The reticle pattern is further projected into a second exposure field of the photoresist layer, wherein a first tapering projection zone of the end section of the first line pattern in the second exposure field overlaps a projection area of the second line pattern in the first exposure field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.