Inventor · Villach, AT

Iris Moder

23Patents
2h-index
27Co-inventors
49Inventor score

Filing activity: Jan 12, 2015 → Jan 8, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10714377B2 Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing Electricity 2 Active
US10325804B2 Method of wafer thinning and realizing backside metal structures Electricity 2 Active
US11476111B2 Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device Electricity 1 Active
US9960076B2 Devices with backside metal structures and methods of formation thereof Electricity 1 Active
US11404262B2 Method for partially removing a semiconductor wafer Electricity 1 Active
US11011409B2 Devices with backside metal structures and methods of formation thereof Electricity 1 Active
US12412740B2 Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device Electricity 0 Active
US11373857B2 Semiconductor surface smoothing and semiconductor arrangement Electricity 0 Active
US10802404B2 Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields Physics 0 Active
US10199372B2 Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures Electricity 0 Active
US9875926B2 Substrates with buried isolation layers and methods of formation thereof Electricity 0 Active
US11038028B2 Semiconductor device and manufacturing method Electricity 0 Active
US12107130B2 Semiconductor device having semiconductor device elements in a semiconductor layer Electricity 0 Active
US12249504B2 Manufacturing and reuse of semiconductor substrates Electricity 0 Active
US9954065B2 Method of forming a semiconductor device and semiconductor device Electricity 0 Active
US10074566B2 Semiconductor device and methods for forming a plurality of semiconductor devices Electricity 0 Active
US10497583B2 Method for manufacturing a semiconductor device comprising etching a semiconductor material Electricity 0 Active
US11881397B2 Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device Electricity 0 Active
US11342433B2 Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices Electricity 0 Active
US9472395B2 Semiconductor arrangement including buried anodic oxide and manufacturing method Electricity 0 Active
US10049914B2 Method for thinning substrates Electricity 0 Active
US11810779B2 Method of porosifying part of a semiconductor wafer Electricity 0 Active
US10535553B2 Devices with backside metal structures and methods of formation thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.