Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation

US10811364B2 · kind B2 · utility

Assignee

• Qorvo US, Inc. · US

Inventors

• Thomas Scott Morris · Lewisville, US
• Stephen Parker · Burlington, US
• Jerry Holt · Hillsborough, US
• John Davisson · Kernersville, US
• Rommel Quintero Nevarez · High Point, US

Key dates

• Filing date: Mar 18, 2019
• Grant date: Oct 20, 2020
• Expiry date: Mar 18, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.