Patent · US Active

Packaged electronic circuits having moisture protection encapsulation and methods of forming same

US10811370B2 · kind B2 · utility

0Cited by

6References

23Claims

0Family size

Assignee

Cree, Inc. · US

Inventors

Kyle Bothe · Cary, US
Dan Namishia · Wake Forest, US
Fabian Radulescu · Chapel Hill, US
Scott Sheppard · Chapel Hill, US

Key dates

Filing date	Apr 24, 2018
Grant date	Oct 20, 2020
Priority date	—
Expiry date	Nov 9, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/6683
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A packaged electronic circuit includes a substrate having an upper surface, a first metal layer on the upper surface of the substrate, a first polymer layer on the first metal layer opposite the substrate, a second metal layer on the first polymer layer opposite the first metal layer, a dielectric layer on the first polymer layer and at least a portion of the second metal layer and a second polymer layer on the dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.