Integrated circuit packages including an optical redistribution layer

US10816742B2 · kind B2 · utility

Assignee

• Intel IP Corporation · US

Inventors

• Georg Seidemann · Landshut, DE
• Christian Geissler · Teugn, DE
• Sven Albers · Regensburg, DE
• Thomas Wagner · Regelsbach, DE
• Marc Dittes · Regensburg, DE
• Klaus Reingruber · Langquaid, DE
• Andreas Wolter · Regensburg, DE
• Richard Patten · Minneapolis, US

Key dates

• Filing date: Nov 6, 2018
• Grant date: Oct 27, 2020
• Expiry date: Nov 6, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12197
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.