Patent · US Active

Metrology system and method for determining a characteristic of one or more structures on a substrate

US10816909B2 · kind B2 · utility

5Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 3, 2018
Grant dateOct 27, 2020
Priority date
Expiry dateDec 26, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01B2210/56
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Described is a metrology system for determining a characteristic of interest relating to at least one structure on a substrate, and associated method. The metrology system comprises a processor being configured to computationally determine phase and amplitude information from a detected characteristic of scattered radiation having been reflected or scattered by the at least one structure as a result of illumination of said at least one structure with illumination radiation in a measurement acquisition, and use the determined phase and amplitude to determine the characteristic of interest.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.