Ambient controlled transfer module and process system

US10818525B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shay Assaf · Santa Clara, US
• Andrew J. Constant · Cupertino, US
• Jacob Newman · Palo Alto, US
• Charles T. Carlson · Cedar Park, US
• William T. Weaver · Austin, US
• Stephen C. Hickerson · Hollister, US

Key dates

• Filing date: Jun 4, 2019
• Grant date: Oct 27, 2020
• Expiry date: Jun 4, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67207
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.