Diffraction based overlay scatterometry
US10824079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring overlay is used in a manufacturing process in which successive layers are deposited one over another to form a stack. Each layer may include a periodic structure such as a diffraction grating to be aligned with a periodic structure in another layer. The stacked periodic structures may be illuminated to form + and − first order diffraction patterns from the periodic structures. An image of the stacked periodic structures may be captured including + and − diffraction patterns. The + and − diffraction patterns may be compared to calculate the overlay between successive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.