Electronic devices having tapered edge walls
US10825761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Nov 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a substrate, a structure over the substrate having an edge wall defining at least a portion of an opening exposing a surface of the substrate, and a dielectric material adjacent and in contact with the edge wall and an adjacent portion of the surface of the substrate. The dielectric material has a profile tapering downward from adjacent the edge wall toward the substrate. Other electronic devices include a substrate and a solder mask over the substrate. The solder mask defines an opening therethrough. A supplemental mask is within the opening of the solder mask, and has a sidewall that slopes away from the solder mask. A conductive structure is adjacent and in contact with at least one of the solder mask or the supplemental mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.