Inventor · Boise, ID, US

Jack E. Murray

10Patents
3h-index
2Co-inventors
50Inventor score

Filing activity: Feb 5, 2000 → Jun 1, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9418926B1 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 11 Active
US6227076A Shaft wrench Performing Operations; Transporting 11 Expired
US10032703B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 4 Active
US10381297B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 3 Active
US11139229B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 1 Active
US10825761B2 Electronic devices having tapered edge walls Electricity 1 Active
US10825762B2 Methods of processing semiconductor devices Electricity 0 Active
US12033929B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 0 Active
US10276479B1 Methods of processing semiconductor devices Electricity 0 Active
US11791252B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.