Patent · US Active

Die attach methods and semiconductor devices manufactured based on such methods

US10832992B2 · kind B2 · utility

1Cited by

8References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Giovanni Ragasa Garbin · Melaka City, MY
Chen Wen Lee · Ipoh, MY
Benjamin Reichert · Lappersdorf, DE
Peter Strobel · Regensburg, DE

Key dates

Filing date	Jul 22, 2019
Grant date	Nov 10, 2020
Priority date	—
Expiry date	Jul 22, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/07811
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.