Microelectronic substrate electro processing system

US10837119B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Robert B. Moore · Bigfork, US
• David Silvetti · معلمی نژاد, US
• Paul Z. Wirth · Kalispell, US
• Randy Harris · Kalispell, US
• Daniel J. Woodruff · Kalispell, US
• Gregory J. Wilson · Kalispell, US

Key dates

• Filing date: Jun 20, 2018
• Grant date: Nov 17, 2020
• Expiry date: Feb 13, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76879
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.