Wetting pretreatment for enhanced damascene metal filling

US10840101B2 · kind B2 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Steven T. Mayer · Lake Oswego, US
• David W. Porter · Tulsa, US
• Mark J. Willey · Portland, US

Key dates

• Filing date: Nov 20, 2017
• Grant date: Nov 17, 2020
• Expiry date: Jun 15, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76898
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.