Mark J. Willey
11Patents
5h-index
19Co-inventors
59Inventor score
Filing activity: Oct 4, 2007 → Nov 20, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7776741B2 | Process for through silicon via filing | Electricity | 38 | Active |
| US8962085B2 | Wetting pretreatment for enhanced damascene metal filling | Electricity | 17 | Active |
| US8992757B2 | Through silicon via filling using an electrolyte with a dual state inhibitor | Electricity | 10 | Active |
| US8372258B2 | Monitoring of electroplating additives | Physics | 7 | Active |
| US9721800B2 | Apparatus for wetting pretreatment for enhanced damascene metal filling | Electricity | 5 | Active |
| US8722539B2 | Process for through silicon via filling | Electricity | 5 | Active |
| US9593426B2 | Through silicon via filling using an electrolyte with a dual state inhibitor | Electricity | 2 | Active |
| US9852913B2 | Wetting pretreatment for enhanced damascene metal filling | Electricity | 2 | Active |
| US9816196B2 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Chemistry; Metallurgy | 1 | Active |
| US8475642B2 | Systems and methods for monitoring plating and etching baths | Physics | 1 | Active |
| US10840101B2 | Wetting pretreatment for enhanced damascene metal filling | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.