Method for preparing conductive via
US10840136B1 · kind B1 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2019 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Jul 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76888
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for preparing a conductive plug. The method includes forming a first conductive structure over a substrate; forming a first dielectric structure over the first conductive structure; transforming a sidewall portion of the first conductive structure into a first dielectric portion; and removing the first dielectric portion such that a width of the first dielectric structure is greater than a width of a remaining portion of the first conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.