Patent · US Active

Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package

US10840172B2 · kind B2 · utility

1Cited by

2References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Bemmerl · Schwandorf, DE
Azlina Kassim · Melaka City, MY
Nurfarena Othman · Melaka City, MY

Key dates

Filing date	Feb 12, 2018
Grant date	Nov 17, 2020
Priority date	—
Expiry date	Feb 12, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18161
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadframe, that is to be incorporated into a semiconductor housing is provided. The leadframe may include a first die pad, a second die pad and a plurality of contact pads. A lower surface of the contact pads and a lower surface of the first die pad are arranged in a first plane. An upper surface of the second die pad is arranged in a second plane distant from the first plane by an overall thickness of the semiconductor package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.