Inventor · Schwandorf, DE

Thomas Bemmerl

29Patents
5h-index
45Co-inventors
69Inventor score

Filing activity: Jun 20, 2002 → Feb 15, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7420262B2 Electronic component and semiconductor wafer, and method for producing the same Electricity 42 Expired
US7064429B2 Electronic package having integrated cooling element with clearance for engaging package Electricity 19 Expired
US7944061B2 Semiconductor device having through contacts through a plastic housing composition and method for the production thereof Emerging Cross-Sectional Technologies 7 Active
US7737537B2 Electronic device Electricity 6 Active
US7935622B2 Support with solder ball elements and a method for populating substrates with solder balls Electricity 6 Active
US8916968B2 Multichip power semiconductor device Electricity 5 Active
US9681566B2 Electronic arrangement and method for producing an electronic arrangement Electricity 3 Active
US8030741B2 Electronic device Electricity 2 Active
US10886186B2 Semiconductor package system Electricity 1 Active
US7713791B2 Panel and semiconductor device having a composite plate with semiconductor chips Emerging Cross-Sectional Technologies 1 Active
US7800241B2 Semiconductor device with semiconductor device components embedded in a plastics composition Electricity 1 Active
US10840172B2 Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package Electricity 1 Active
US10971457B2 Semiconductor device comprising a composite material clip Electricity 1 Active
US11088105B2 Semiconductor device and method for fabricating a semiconductor device Electricity 1 Active
US9443760B2 Multichip power semiconductor device Electricity 0 Active
US8848297B2 Lens, optoelectronic component comprising a lens and method for producing a lens Emerging Cross-Sectional Technologies 0 Active
US10026710B2 Electronic arrangement Electricity 0 Active
US7709379B2 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof Emerging Cross-Sectional Technologies 0 Active
US8748201B2 Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer Electricity 0 Active
US10978378B2 Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier Electricity 0 Active
US11955415B2 Semiconductor device package comprising a pin in the form of a drilling screw Electricity 0 Active
US11869830B2 Semiconductor package and clip with a die attach Electricity 0 Active
US12334405B2 Electronic devices including vent openings and associated methods Electricity 0 Active
US11869865B2 Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof Electricity 0 Active
US12394697B2 Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.