Patent · US Active

Method and apparatus for measuring process kit centering

US10847393B2 · kind B2 · utility

5Cited by

4References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Charles G. Potter · San Jose, US
Eli Mor · Garden City, US

Key dates

Filing date	Sep 4, 2018
Grant date	Nov 24, 2020
Priority date	—
Expiry date	Nov 17, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB65H2515/70
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.