Test structures for measuring silicon thickness in fully depleted silicon-on-insulator technologies
US10852337B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 1, 2017 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Aug 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described are test structures and methods for measuring silicon thickness in fully depleted silicon-on-insulator technologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.