Dynamic temperature compensation in a memory component
US10852953B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Jan 4, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/028
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dynamic temperature compensation trim for use in temperature compensating a memory operation on a memory call of a memory component. The dynamic temperature compensation trim is based on a temperature of the memory component and based on in-service data for the memory operation on the memory cell. A register for the memory operation is modified based on the dynamic temperature compensation trim.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.