Patent · US Active

Wafer-supporting device and method for producing same

US10854498B2 · kind B2 · utility

3Cited by

1,496References

6Claims

0Family size

Assignee

ASM IP Holding B.V. · NL

Inventors

Fumitaka Shoji · Kawasaki, JP
Hideaki Fukuda · Hachioji, JP

Key dates

Filing date	Jul 15, 2011
Grant date	Dec 1, 2020
Priority date	—
Expiry date	Aug 30, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/5096
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A wafer-supporting device for supporting a wafer thereon adapted to be installed in a semiconductor-processing apparatus includes: a base surface; and protrusions protruding from the base surface and having rounded tips for supporting a wafer thereon. The rounded tips are such that a reverse side of a wafer is supported entirely by the rounded tips by point contact. The protrusions are disposed substantially uniformly on an area of the base surface over which a wafer is placed, wherein the number (N) and the height (H [μm]) of the protrusions as determined in use satisfy the following inequities per area for a 300-mm wafer: (−0.5N+40)≤H≤53;5≤N≤100.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.