Methods for defect validation
US10859926B2 · kind B2 · utility
6Cited by
2References
24Claims
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Key dates
| Filing date | May 25, 2016 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | May 25, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of defect validation for a device manufacturing process, the method including: obtaining a first image of a pattern processed into an area on a substrate using the device manufacturing process under a first condition; obtaining a metrology image from the area; aligning the metrology image and the first image; and determining from the first image and the metrology image whether the area contains a defect, based on one or more classification criteria.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.