Electronic package carrier structure thereof, and method for fabricating the carrier structure
US10863626B1 · kind B1 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.