Heat spreading device and method
US10867885B2 · kind B2 · utility
7Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Sep 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a device includes: an integrated circuit die having a first side and a second side opposite the first side; a die stack on the first side of the integrated circuit die; a dummy semiconductor feature on the first side of the integrated circuit die, the dummy semiconductor feature laterally surrounding the die stack, the dummy semiconductor feature electrically isolated from the die stack and the integrated circuit die; a first adhesive disposed between the die stack and the dummy semiconductor feature; and a plurality of conductive connectors on the second side of the integrated circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.