Inventor · Taichung, TW

Ming-Fa Chen

426Patents
21h-index
94Co-inventors
93Inventor score

Filing activity: Sep 5, 1997 → Jun 24, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8803292B2 Through-substrate vias and methods for forming the same Electricity 368 Active
US9859254B1 Semiconductor structure and a manufacturing method thereof Electricity 261 Active
US8158456B2 Method of forming stacked dies Electricity 123 Active
US9899355B2 Three-dimensional integrated circuit structure Electricity 61 Active
US9698081B2 3D chip-on-wafer-on-substrate structure with via last process Electricity 60 Active
US10510650B2 Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias Electricity 54 Active
US9524959B1 System on integrated chips and methods of forming same Electricity 49 Active
US10522449B2 Packages with Si-substrate-free interposer and method forming same Electricity 48 Active
US10541228B2 Packages formed using RDL-last process Electricity 45 Active
US8378480B2 Dummy wafers in 3DIC package assemblies Electricity 44 Active
US10541227B2 System on integrated chips and methods of forming same Electricity 43 Active
US10373885B2 3D stacked-chip package Electricity 43 Active
US8174124B2 Dummy pattern in wafer backside routing Electricity 31 Active
US10510629B2 Integrated circuit package and method of forming same Electricity 28 Active
US8049327B2 Through-silicon via with scalloped sidewalls Electricity 27 Active
US5989754A Photomask arrangement protecting reticle patterns from electrostatic discharge damage (ESD) Physics 27 Expired
US8501587B2 Stacked integrated chips and methods of fabrication thereof Electricity 26 Active
US9666520B2 3D stacked-chip package Electricity 22 Active
US8053902B2 Isolation structure for protecting dielectric layers from degradation Electricity 21 Active
US7910473B2 Through-silicon via with air gap Electricity 21 Active
US8791549B2 Wafer backside interconnect structure connected to TSVs Electricity 21 Active
US8362591B2 Integrated circuits and methods of forming the same Electricity 19 Active
US10157867B1 Interconnect structure and method Electricity 18 Active
US8399354B2 Through-silicon via with low-K dielectric liner Electricity 17 Active
US9142533B2 Substrate interconnections having different sizes Electricity 16 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.