System for predicting properties of structures, imager system, and related methods

US10872403B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Amitava Majumdar · Boise, US
• Qianlan Liu · Boise, US
• Pradeep Ramachandran · Lehi, US
• Shawn D. Lyonsmith · Boise, US
• Steve K. McCandless · Nampa, US
• Ted Taylor · Boise, US
• Ahmed N. Noemaun · Boise, US
• Gordon A. Haller · Boise, US

Key dates

• Filing date: Aug 10, 2018
• Grant date: Dec 22, 2020
• Expiry date: Dec 4, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/14
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.