Molded semiconductor package with double-sided cooling

US10886199B1 · kind B1 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Chau Fatt Chiang · Melaka City, MY
• Swee Kah Lee · Melaka City, MY
• Josef Maerz · Oberhaching, DE
• Thomas Stoek · Buxtehude, DE
• Chee Voon Tan · Seremban, MY

Key dates

• Filing date: Jul 17, 2019
• Grant date: Jan 5, 2021
• Expiry date: Jul 17, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/186
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing a molded semiconductor package includes: attaching a first load terminal at a first side of a semiconductor die to a leadframe, the semiconductor die having a second load terminal at a second side opposite the first side and a control terminal at the first side or the second side; encapsulating the semiconductor die in a laser-activatable mold compound so that the leadframe is at least partly exposed from the laser-activatable mold compound at a first side of the molded semiconductor package, and the second load terminal is at least partly exposed from the laser-activatable mold compound at a second side of the molded semiconductor package opposite the first side; and laser activating a first region of the laser-activatable mold compound to form a first laser-activated region which forms part of an electrical connection to the second load terminal.