Inventor · Seremban, MY

Chee Voon Tan

11Patents

2h-index

29Co-inventors

50Inventor score

Filing activity: Nov 25, 2009 → Jun 21, 2021

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9478484B2	Semiconductor packages and methods of formation thereof	Electricity	5	Active
US9111772B1	Electronic array and chip package	Electricity	2	Active
US10886199B1	Molded semiconductor package with double-sided cooling	Electricity	1	Active
US10037934B2	Semiconductor chip package having contact pins at short side edges	Electricity	0	Active
US11515244B2	Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture	Electricity	0	Active
US11699640B2	Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production	Electricity	0	Active
US9263421B2	Semiconductor device having multiple chips mounted to a carrier	Electricity	0	Active
US11211356B2	Power semiconductor package and method for fabricating a power semiconductor package	Electricity	0	Active
US11302613B2	Double-sided cooled molded semiconductor package	Electricity	0	Active
US11587800B2	Semiconductor package with lead tip inspection feature	Electricity	0	Active
US8664753B2	Semiconductor device with protruding component portion and method of packaging	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.