Micro LED structure and method of manufacturing same
US10886446B2 · kind B2 · utility
4Cited by
1References
1Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 30, 2019 |
| Grant date | Jan 5, 2021 |
| Priority date | — |
| Expiry date | Jul 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.