Method for determining a junction temperature of a device under test and method for controlling a junction temperature of a device under test
US10890614B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | May 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a method for controlling a junction temperature of a device under test, including applying a reverse bias to a reference diode adjacent to the device under test, obtaining a calibration current of the reference diode under the reverse bias, deriving the junction temperature of the device under test according to the reference diode, and adjusting an environment temperature when the junction temperature of the device under test is deviated from a predetermined value by a predetermined temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.