Lift pin assembly

US10892180B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Bonnie T. Chia · Sunnyvale, US
• Jallepally Ravi · Santa Clara, US
• Manjunatha Koppa · Kanchinakote, IN
• Vinod Konda Purathe · Bengaluru, IN
• Cheng-Hsiung Tsai · Cupertino, US
• Aravind Kamath · San Jose, US

Key dates

• Filing date: Aug 2, 2014
• Grant date: Jan 12, 2021
• Expiry date: Aug 30, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C30B25/12
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.