Electronic device comprising a support substrate and an encapsulating cover for an electronic component
US10892201B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
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Key dates
| Filing date | Feb 12, 2020 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Feb 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.