Semiconductor device
US10896891B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 15, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Mar 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/911
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a semiconductor substrate; a plurality of first pad electrodes provided above the semiconductor substrate; a plurality of first wires electrically connected to the plurality of first pad electrodes respectively; a first electrode commonly connected to the plurality of first wires; a second pad electrode provided above the semiconductor substrate; and a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.